Technology

Cutting-edge MOSFET packaging solutions, transitioning from traditional designs to advanced automotive-grade and next-generation power packages.

• Traditional packaging gradually being replaced by high-performance alternatives
• Advanced automotive-grade packaging for better heat dissipation
• Next-generation designs with innovative thermal management
• Multi-core integration for higher power density and efficiency

Innovative TOLL and TOLT packaging technology featuring reduced thermal resistance, enhanced heat dissipation, and improved switching efficiency.

• Significant reduction in thermal and internal resistance
• Improved overcurrent capability and switching efficiency
• Optimized heat dissipation for enhanced performance